Product Lines

A

HV switches with current depending on-time, Thyristor / SCR  

Robust and inexpensive HV switch for discharge applications and for the generation of damped sinusoidal oscillations in connection with fast high voltage FDA free-wheeling diodes High peak current capability  Extremely high di/dt without compromises in reliability and life expectancy due to a large number of single SCR’s with individual gate drive Very overload tolerant     Easy firing by a simple TTL trigger pulse (2-5 V)  Very compact and light weight  ● Various cooling options
Aplication Note: Unlike classical disc thyristor switches with very limited dv/dt and di/dt capabilities, the fast BEHLKE thyristor switching modules are made of a very large number of smaller thyristor dies (type depending up to 1000 single thyristors), connected in parallel and in series, so that the extreme dv/dt and di/dt is efficiently splitted to uncritical values for the the single thyristors. Every single thyristor is fired by its own highly synchronized and isolated gate driver. This makes a very short gate wiring possible and avoids dangerous hot spots known from classical thyristor switch designs. BEHLKE thyristor switches can safely be operated at the highest physically possible di/dt and dv/dt rates and at the highest possible peak currents without any measurable descent of the life expectancy. BEHLKE thyristor switches are truly gate controlled and do not draw firing energy from the load circuit. This allows a safe switching from almost 0 V (sufficient snap-in current provided) to the maximum voltage without any restriction.

The switches are isolated for at least 150% of the maximum operating voltage, so that high-side switching applications can be realized without big effort. In order to save costs and built volume, especially in low side switch applications (e.g. crowbar circuits), all BEHLKE thyristor switches can also be made with an optionally available asymetrical isolation, e.g. 200 kV for the plus pole and 30 kV for the minus pole. Special isolation voltage requirements can be fulfilled by customized isolation voltage ratings for every thyristor switch model regardless to its operating voltage. The "regular" isolation voltage options range from 40 kV to 200 kV (opt. ISO-40, ISO-80, ISO-120, ISO-200). A "medical certification" according to the European safety standards is available on request. Any customized voltage between 1 and 150 kV (AC/DC) and any customized peak current between 1 and 100 kA is possible at lead times of about 4-8 weeks. We do not charge extra costs for customized switches, if they can be realized on an existing platform. Please consult BEHLKE.

In order to connect several thyristor switches in parallel, they are equipped with a synchronization I/O. This feature ensures the synchron firing and inhibits the trigger input of the other switching modules, if one switch is off due to a fault condition (e.g. over-temperature). Due to the strong electromagnetic fields, which can be caused by the high di/dt capabilty of the switches, a separate control unit  (option SEP-C)  is recommended in all cases of
large induction loop areas.
This applies especially for very large switching modules and if the di/dt is > 5 kA/Ás. For applications with small and medium switching modules we recommend printed circuit boards (eventually in multilayer technique) to minimize the stray inductance and to keep the areas of induction loops small. 

A design with printed circuit boards guarantees also a reproducible EMC behavior of the whole electronic system.  Please ensure in any case, that the load circle is in proper distance to the control circle to avoid magnetic feed-back effects, otherwise the internal safety electronics will detect a fault condition and the switch will be locked for 2 sec. after every shot. Most switches indicate this by a red LED.


All BEHLKE thyristor switches are optionally available with a grounded cooling flange (option GCF), with nickel plated copper cooling fins (option CF), with graphite cooling fins (option CF-GRA, with ceramic cooling fins (option CF-CER), with water cooling (option ILC), direct liquid cooling for non-conductive coolants (option DLC) or with ceramic cooling surface (option CSS).


In order to avoid corona discharge from cooling fins on high voltage potential we recommend direct liquid cooling (option DLC) or ceramic cooling fins (option CF-CER) or water cooling (option ILC) for the cooling at voltages above 40 kV.


Export Restrictions:
Fast solid-state switches with a maximum peak current equal or higher than 500 Amperes are export restricted according to the United States law as well as the German law (dual use regulation). These goods must not be exported to third countries without a valid export permit of the US or German export authorities. An enduser statement may be required. Please consult BEHLKE.

Product Code:
The model number contains coded information about voltage, current and turn-on behavior. The first digits stand for the voltage in kV, the last digit before the dash indicates the turn-on behavior (0 = fixed on-time, 1 = variable on-time). The digits after the dash indicate the current  in Amperes x10. Special features are coded by the letters after a second dash. Example HTS 60-100-SCR:  HTS = HV Thyristor Switch, 6 = 6 kV,  0 = current depending fixed on-time, 100 = 1000 Ampere, SCR = Silicone Controlled Rectifier (thyristor).

Switch Model
[sorted by voltage]

Description / Comment
Preferred stock type  Lead time > 6 weeks  X Not for new development 

Max. Voltage
[kV]

Peak Current
[A]

Peak Power
 [MW]

  On-   Time
[μs]

Housing Dimensions
[mm3]

Drawing
(PDF)
HTS 40-1000-SCR Sync. I/O for parallel connection.
4
10000
40
35…∞
89 x 64 x 31
request
HTS 60-1000-SCR Sync. I/O for parallel connection.
6
10000
60
35…∞
122 x 64 x 31
request
HTS 60-100-SCR Tubular housing with HV pigtails. Cooling options not available.
6.4
1000
6.4
35…∞
135 x 20 x 20
request
HTS 60-200-SCR LED indicators. Very compact design - CF options partly not applicable!
6.4
2000
12.8
35…∞
80 x 38 x 25
PDF
HTS 80-200-SCR Sync. I/O for parallel connection.
8
2000
16
35…∞
89 x 64 x 31
request
HTS 80-500-SCR Sync. I/O for parallel connection.
8
5000
40
35…∞
89 x 64 x 31
PDF
HTS 80-1000-SCR Sync. I/O for parallel connection.
8
10000
80
35…∞
153 x 64 x 31
PDF
HTS 100-1600-SCR LED indicators & Sync. I/O for parallel connection
10
16000
160
35…∞
179 x 103 x 35
request
HTS 120-200-SCR Sync. I/O for parallel connection.
12
2000
24
35…∞
122 x 64 x 31
request
HTS 120-500-SCR Sync. I/O for parallel connection.
12
5000
60
35…∞
122 x 64 x 31
PDF
HTS 120-1600-SCR LED indicators & Sync. I/O for parallel connection
12
16000
192
35…∞
204 x 103 x 35
request
HTS 120-100-SCR LED indicators. Very compact design - CF options partly not applicable!
12.8
1000
12.8
35…∞
80 x 38 x 25
PDF
HTS 150-200-SCR LED indicators. Very compact design - CF options partly not applicable!
15
2000
30
35…∞
103 x 70 x 35
request
HTS 160-200-SCR Sync. I/O for parallel connection. HV connection by pigtails only.
16
2000
32
35…∞
89 x 64 x 31
request
HTS 160-500-SCR Sync. I/O for parallel connection.
16
5000
80
35…∞
153 x 64 x 31
PDF
HTS 160-200-SCR Sync. I/O for parallel connection.
16
2000
32
35…∞
153 x 64 x 31
request
HTS 160-1600-SCR LED indicators & Sync. I/O for parallel connection
16
16000
256
35…∞
253 x 103 x 35
request
HTS 200-800-SCR LED indicators & Sync. I/O for parallel connection
20
8000
160
35…∞
179 x 103 x 35
request
HTS 220-800-SCR LED indicators & Sync. I/O for parallel connection
22
8000
176
35…∞
179 x 103 x 35
request
HTS 220-1000-SCR LED indicators & Sync. I/O for parallel connection
22
10000
220
35…∞
252 x 150 x 40
request
HTS 220-1200-SCR LED's, Sync. I/O,  housing style as before, but with separate control unit
22
12000
264
35…∞
160 x 150 x 30
PDF
HTS 240-100-SCR LED indicators. Very compact design - CF options partly not applicable!
24
1000
24
35…∞
103 x 70 x 35
PDF
HTS 240-800-SCR LED indicators & Sync. I/O for parallel connection
24
8000
192
35…∞
204 x 103 x 35
request
HTS 240-1000-SCR LED indicators & Sync. I/O for parallel connection
24
10000
240
35…∞
252 x 150 x 40
request
HTS 240-1200-SCR LED's, Sync. I/O,  housing style as before, but with separate control unit
24
12000
288
35…∞
160 x 150 x 30
request
HTS 300-100-SCR LED indicators. Very compact design - CF options partly not applicable!
30
1000
30
35…∞
103 x 70 x 35
request
HTS 320-200-SCR Sync. I/O for parallel connection. HV connection by pigtails only.
32
2000
64
35…∞
153 x 64 x 31
request
HTS 320-800-SCR LED indicators & Sync. I/O for parallel connection
32
8000
256
35…∞
253 x 103 x 35
request
HTS 320-200-SCR LED indicators. Very compact design - CF options partly not applicable!
32
2000
64
35…∞
206 x 70 x 35
request
HTS 350-800-SCR  With LED indicators, enlarged housing, many options simultaneously integratable 35   8000 280 35…∞ 372 x 200 x 43 request
HTS 400-200-SCR LED indicators. Very compact design - CF options partly not applicable!
40
2000
80
35…∞
312 x 120 x 38
request
HTS 440-1200-SCR Sync. I/O for parallel connection, separate control unit
44
12000
528
35…∞
312 x 200 x 45
request
HTS 500-1200-SCR Sync. I/O for parallel connection, separate control unit 50 12000 600 35…∞ 372 x 200 x 50 request
HTS 600-200-SCR With LED indicators. HV connection by pigtails only.
60
2000
120
35…∞
372 x 120 x 50
request
HTS 640-100-SCR LED indicators. Very compact design - CF options partly not applicable!
64
1000
64
35…∞
206 x 70 x 35
request
HTS 800-100-SCR LED indicators. Very compact design - CF options partly not applicable!
80
1000
80
35…∞
312 x 120 x 38
PDF
HTS 1200-100-SCR With LED indicators. HV connection by pigtails only.
120
1000
120
35…∞
372 x 120 x 50
request
HTS 1200-2400-SCR Flange or tubular housing. External control unit.
120
24000
2880
35…∞
672 x 400 x 68
request
HTS 1500-1000-SCR Sync. I/O for parallel connection, separate control unit 150 10000 1500 35…∞ on request request

Options (1)

 

 

HFB

High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.

HFS

High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded.(2)

LP

Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps.  Improved noise immunity and  less critical wiring in high speed applications. (3)

ST

Stage Tapping:  Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo).

ISO-25

25 kV Isolation:  Isolation Voltage increased to  25 kVDC. Housing dimensions may change for some models.

ISO-40

40 kV Isolation:  Isolation Voltage increased to  40 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.

ISO-80

80 kV Isolation:  Isolation Voltage increased to  80 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.

ISO-120

120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

I-PC

Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, damping resistors, diodes, opto couplers).(2)

I-FWD

Integrated Free-Wheeling Diode:  Built-in parallel diode with short recovery time. In connection with inductive load only.

LS-C

LEMO socket for Control Connection: Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. Improved noise immunity. (3)

PT-C

Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-Modu plug. Only for switches with pins, which must be replaced by pigtails in case of any cooling option except option ITC.

PIN-C

Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard.

PT-HV

Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits.

ST-HV

Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.

SEP-C

Separated Control Unit: Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails.

FOI-C

Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)

FOO-F

Fibre Optics Output / Fault: Additional optical output to read-out the failure condition of the switch by means of a fibre-optical signal (only in combination with option SEP-C) (2)

UL94

Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)

FH Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.

TH

Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case  of difficult assembly situations. (2)

FC

Flat Case: Height of standard plastic housings reduced to 19 / 25 mm. Not in combination with cooling options CF, GCF and DLC.

ITC

Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)

CF

Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.

CF-1

Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).

CF-X2

Copper Cooling Fins "XL": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.

CF-X3

Copper Cooling Fins "XXL": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.

CF-CS

Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1, CF-D and CF-S for increased cooling power.

CF-LC

Copper Cooling Fins for liquid cooling: Double fins, nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced convection recommended. Combinable with opt. CF-S.

CF-D

Double Copper Cooling Fins: Approx. 100% more cooling power, approx. 2mm spacing between fins, forced convection recommended. Combinable with opt. CF-S, CF-X2, CF-X3 and CF-CS.

CF-S

Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D, CF-X2, CF-X3 and CF-CS.

CF-GRA

Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer, but reduced heat capacity. 0.5 or 1 mm thickness, height 35 mm.

CF-CER

Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.

CCS

Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.

CCF

Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.

C-DR

Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)

GCF

Grounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance. In combination with option SPT-C only.

GCF-X2

Grounded Cooling Flange, Max. Continuous Power Dissipation increased by x2:  Thermal resistance “Switch to Flange” reduced for twice the power capability. (2)

ILC

Indirect Liquid Cooling:  Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.

DLC

Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.

HI-REL

High Reliability / MIL Versions:  Available on request. (2)

 

(1) New option code:  Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table.    (2) Please consult factory for detailed information.
(3) These options are EMC-relevant and are recommended for industrial power applications, difficult noise ambient, prototype experiments with flying leads and for users without special EMC design experience.

 

Further information, data sheets and drawings are available on request. All data and specifications subject to change without notice.

REV 05-AUG-2016
 

Product Lines